The Hong Kong Polytechnic University

Industrial Centre

Training Module IC1133

 

 

Module Title：            Electronic Manufacturing Practice

Module Code：           IC1133

Pre-requisites：         Nil

Duration:                   4 days

Mode of Study:           Project work + tutorial/guided learning

Assessment:               70% Coursework + 30% test

 

Objectives:

This module aims at developing students’ understanding on the principles and operations of common electronic manufacturing processes; properties and applications of common electronic components and materials through hands-on practices.

 

On completion of this module, students should be able to:

·        Understand the properties and operation of basic electronic components and materials;

·        Apply soldering, wiring and assembly techniques for  electronic assembly;

·        Understand PCB fabrication process;

·        Understand electronic manufacturing processes for electronic assembly.

 

 

Indicative Contents:

Key concepts, appreciation and practice on electronics and PCB materials; characteristics and packaging; electronic tools and materials; soldering and de-soldering techniques; prototype making; PCB fabrication process; dry films; photochemical etching, photo-resists, NC drilling; Electronic Assembly process; wave-soldering process; re-flow soldering and vapor soldering; PCB assembly cleaning, inspection and re-work techniques; SMT components, packaging and process; solder paste and adhesive; COB and LCD heat  sealing process.

 

Schedule of the Training Module:

 

Area / Topic

Duration (days)

Basic Electronics

  • Key concepts, components,  soldering techniques and materials
  • Prototyping and PCB wiring techniques
  • Use of tools and equipment
  • Reliability and maintainability of equipment

 

       1

PCB Fabrication

  • PCB material, NC drilling, dry film imaging, photo-chemical etching
  • Single-sided and double-sided PCB fabrication process
  • Environmental protection issues

 

       1

PCB Assembly Process

  • Electronic Assembly processes
  • Wave-soldering, reflow soldering and vapor soldering
  • PCB assembly cleaning and re-work techniques
  • SMT components, packaging and process
  • Solder paste and adhesive
  •  COB and LCD heat sealing process

 

       2

Total

      4

 

 

Teaching/Learning Approach:

The course will be conducted on project basis with theoretical supplement. The general principles, techniques and related technologies will be presented to students. Students learn the required skills through practical exercises and case studies. Their learning skills will be strengthened through individual or projects for developing their problem solving skills, integrating their learning and applying their learning techniques under real world environment.

 

Project Work:

Mini-projects for basic electronics and PCB fabrication will be assigned to the students in addition to training exercises. Typical mini-projects will be Electronic Organ and Decision Maker.

 

Indicative Reading List:

 

  1. Clyde F. Coombs, Coomb’s Printed Circuit Handbook, 6h Edition, McGraw-Hill, 2007
  2. Charles A. Harper, Electronic Assembly Fabrication: Chips, Circuit boards, packages, and components, 2002.
  3. Witte, Robert A., Electronic Test Instruments, 2nd Edition, Prentice Hall, 2002
  4. Reading materials published by Industrial Centre on training topics