The Hong Kong Polytechnic University

Industrial Centre

Training Module IC1135

 

 

Module Title：             SMT Design and Manufacturing

Module Code：            IC1135

Pre-requisites：          IC1131

Duration:                    4 days

Mode of Study:            Project work + tutorial/guided learning

Assessment:                70% Coursework + 30% test

 

Objectives:

This module aims at developing students’ understanding on the principles and operations of common SMT design and manufacturing tools and equipment; properties and applications of common materials; and selection and control of common PCB assembly processes through hands-on practical work.

 

At the conclusion of this module, students will be:

·         Competent in applying engineering techniques, skills, tools and equipment in SMT assembly  process

·         Competent in applying CAD tools for designing SMT PCB for manufacturing

 

 

Indicative Contents:

 

Key concepts, appreciation and practice on SMT design and manufacturing; introduction to SMT, BGA and COB technologies:  devices, packages, advantages, production efficiency, machine and tools; SMT PCB design and board assembly types; PCB design for manufacturing. SMT and mixed technologies soldering processes: IR reflow and wave-soldering; solder pastes and adhesives; pick and place machine programming and application; reflow oven; automatic screen printing machine;   X-ray inspection machine; SMT rework process and quality control; COB process and techniques; LCD heat sealing techniques.

 

Schedule of the Training Module:

 

Area / Topic

Duration (days)

Soldering Process

  • Electronic Assembly processes
  • Wave-soldering, reflow soldering and vapor soldering
  • PCB assembly cleaning and re-work techniques

 

       1

SMT assembly process

  • SMT components and packaging
  • Solder paste and adhesive
  • BGA, COB and LCD heat sealing process
  • SMT pick-n-place, hot-air reflow oven, automation screen printing and x-ray inspection machines

 

       2

SMT PCB design for manufacturing

  • Traces, spacing, pads and components orientation for SMT devices
  • Power distribution , coupling, copper thickness
  • Testability and assembly requirement for SMT process

 

       1

Total

       4

 

 

Teaching/Learning Approach:

The course will be conducted on project basis with theoretical supplement. The general principles, techniques and related technologies will be presented to students. Students learn the required skills through practical exercises and case studies. Their learning skills will be strengthened through individual or projects for developing their problem solving skills, integrating their learning and applying their learning techniques under real world environment.

 

Project Work:

Mini-projects for SMT design and manufacturing will be assigned to the students in addition to training exercises. Typical mini-projects will be Voice memo, Music box and Alarm clock.

 

Indicative Reading List:

 

  1. Clyde F. Coombs, Coomb’s Printed Circuit Handbook, 6h Edition, McGraw-Hill, 2007
  2. Charles A. Harper, Electronic Assembly Fabrication: Chips, Circuit boards, packages, and components, 2002.
  3. Witte, Robert A., Electronic Test Instruments, 2nd Edition, Prentice Hall, 2002
  4. Reading materials published by Industrial Centre on training topics